ライフサイエンスコーパス: solder

1 the heatsink material and gold-tin eutectic solder.

2 with site-specific binding involving liquid solder.

3 s of capillary interactions involving liquid solder.

4 ne that are normally considered corrosive to solder.

5 t report of dye-protein conjugates as tissue solders.

6 e been exposed to harsh climate after reflow soldering.

7 article, a key tenet in developing heat-free solders, 2) inductive effects play a critical role in un

8 ns, using the organic termini to chemically "solder" a single cluster to two nanoelectrodes.

9 ging from high-performance turbine blades to solder alloys.

10 owermost metal layer is a high melting point solder and acts as a core.

11 This simple and low cost technique for soldering and fabrication enables formation of complex s

12 ly active, and is a component in low-melting solders and solid-state lubricants.

13 ary interactions between the drops of molten solder; and (v) the assembly is finished by several proc

14 The completed micro-solder-bead bridges were found to have relatively low re

15 t, to trap, move, and chain individual micro-solder-beads in real-time via dielectrophoresis, we demo

16 alvanic couple, in which the normally anodic solder becomes cathodic to copper via a reaction with fr

17 w-melting point, high surface roughness SnAg solder bump features is presented.

18 The multilayer solder bump is a lead free ternary solder system, which

19 stribution of individual elements inside the solder bump matrix.

20 p on a sequentially electroplated multilayer solder bump with tailored transformation imprinted melti

21 d by AFM, which revealed some regions to be "soldered" by proteins, others to be heavily complexed wi

22 three sources predominate: (1) food from Pb-soldered cans, (2) turmeric, or (3) geophagous materials

23 erve that fast intrinsic diffusion in SnAgCu solder causes void growth and coalescence, while in the

24 The substrates presented patterned, solder-coated areas that acted both as receptors for the

25 g complementary shapes, circuits, and liquid solder-coated areas were suspended in ethylene glycol an

26 Chloramine did not similarly inhibit solder corrosion over the 4-9 month test duration, resul

27 g point of interconnects for applications in solder directed fluidic self-assembly.

28 cale polyhedra, with surfaces patterned with solder dots, wires, and light-emitting diodes, generated

29 dra-patterned with logic devices, wires, and solder dots-were connected in a linear string by using f

30 polymer rods-with embedded beads and exposed solder drops-are suspended in an approximately isodense

31 he GO/PEDOT gel can function as a metal-free solder for creating mechanical and electrical connection

32 These compounds can be used as "solders" for semiconductors widely used in photovoltaics

33 primary prevention, including removal of Pb solder from canned food, regulating lead-based paint, an

34 t the electrochemical reversal of the copper-solder galvanic couple, in which the normally anodic sol

35 exposed areas of the beads are coated with a solder having a low melting point; (iv) the polymer rods

36 The addition of solder helped to bond crystal surfaces and link nano- or

37 s a substitute for the conventional tin-lead solder in all devices.

38 Galvanic corrosion of lead-tin solder in copper plumbing can be a major contributor to

39 etwork (CNN) for non-destructive analysis of solder interconnects.

40 nd coalesce along the intermetallic compound/solder interface during EM testing.

41 ray of seven thin-wall stainless steel tubes soldered into a central hole of a cylindrical heating bl

42 modalities in the form of a 450 nm laser and soldering iron (both below $200).

43 riments to validate our simulations, using a soldering iron tip as a point heating source on a metal

44 electromigration in a Pb-free beta-Sn based solder joint by synchrotron polychromatic X-ray microdif

45 The common alloy used in solder joint fabrication is SAC305 (Sn-Ag-Cu).

46 esults provide a basis for designing optimum solder joint microstructures for thermal fatigue resista

47 the EM behavior of Sn-Ag solders within the solder joint structure has been focused on thus far.

48 ts of combined fatigue and creep stresses on solder joints are also investigated in this paper.

49 ing reliability model to predict the life of solder joints in common applications.

50 ning framework for reliability assessment of solder joints in electronic systems; we propose a correl

51 th great precision, the nucleation of tin in solder joints is currently left to chance.

52 The test vehicle includes individual solder joints of SAC305 alloy assembled on a printed cir

53 n approach to incorporate the nucleants into solder joints to control the orientation of the tin nucl

54 meters involved in the failure evolutions in solder joints under a thermo-mechanical process directs

55 plitude, and creep dwell time on the life of solder joints were considered.

56 edict the interconnect operational faults of solder joints with an accuracy of up to 89.9% based on n

57 tigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompl

58 A case study will evaluate the role of solder material and the joint thickness on the reliabili

59 imited by the fatigue life of interconnected solder materials, which is influenced by many factors.

60 PA inclusions (e.g., Field's metal, Pb-based solder), mechanical rigidity can be actively tuned with

61 This polyphenol molecular soldering method has been validated for various polymers

62 rther explore the relative importance of the solder microstructure versus the joint location in the a

63 le linkages between nanoparticle assemblies, soldering nanoelectronics, and constructing nanosensor d

64 rs, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating t

65 o wood dust (OR = 1.5; 95% CI: 0.8, 2.8) and solders (OR = 2.6; 95% CI: 0.9, 7.1).

66 ting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has be

67 sealed with a solder strip (POCW; n = 5), a solder patch (CPCW; n = 5), or three interrupted nylon 1

68 s was 82.76 mm Hg (SD, 6.55), whereas in the solder patch it was 101.42 mm Hg (SD, 29.92; P = 0.2222)

69 il-water interface before they assemble on a solder-patterned substrate that is pulled through the in

70 tween silicone oil, water, and a penetrating solder-patterned substrate.

71 fied) but could have been present in bricks, solder, pigs, or some other anthropogenic component rela

72 (SD, 9.38), and the mean IOP achieved in the solder repaired eyes was 125.16 mm Hg (SD, 9.85; P = 0.0

73 ound, a diode laser was used to activate the solder, resulting in cross-linking to tissue.

74 rs form a low melting point Bi(33.7)In(66.3) solder shell (72 degrees C).

75 This solder shell enables fluidic self-assembly and self-alig

76 Here, a facile in situ molecularly soldered strategy was developed to fabricate defect-free

77 Here, we report a molecular soldering strategy featuring multifunctional polyphenols

78 Wounds were sealed with a solder strip (POCW; n = 5), a solder patch (CPCW; n = 5)

79 The chosen ternary solder system enables the realization of interconnects w

80 ultilayer solder bump is a lead free ternary solder system, which provides a route to transform the m

81 eliminate the defects in the stacked COF by soldering the COF crystals, fortifying the mechanical pr

82 demonstrate how an optimal selection of the solder thickness balances the damage types and considera

83 growth and coalescence, while in the SN100C solder this coalescence was not significant.

84 he air-bridged diode die, which is flip-chip soldered to the patch, has ultra-low parasitic capacitan

85 ility of realistic PCBA component geometries soldered using reflow process, from the perspective of t

86 The tested laser-activated solder was as effective as sutures when used as a patch

87 After the solder was placed on the wound, a diode laser was used t

88 or example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films wi

89 Minimization of the free energy of the solder-water interface provided the driving force for th

90 In this investigation, SnAgCu and SN100C solders were electromigration (EM) tested, and the 3D la

91 the particle type (Pb(II) > Brass > Pb(IV) > solder), while that of field particles was distributed b

92 e shell yielding a stable high melting point solder with adjustable melting points.

93 eness of a laser-activated biological tissue solder with that of standard sutures for sealing corneal

94 However, only the EM behavior of Sn-Ag solders within the solder joint structure has been focus