ライフサイエンスコーパス: etch

1 mask for subsequent material deposition (or etching).

2 rowth substrate is removed with a XeF2 vapor etch.

3 arious shapes are patterned via reactive-ion etching.

4 owth, (3) templated growth, and (4) chemical etching.

5 layer deposition (ALD) assisted sacrificial etching.

6 d with platinum-salt infiltration and plasma etching.

7 as localised electron beam induced chemical etching.

8 tionality controlled metal-assisted chemical etching.

9 hrinkage of molecule in turn leading to core etching.

10 , atomic layer deposition, and oxygen plasma etching.

11 pproach, dry-etching and subsequent chemical etching.

12 aphy, thin film deposition, and reactive ion etching.

13 concentrations without aggregation or silver etching.

14 bstrates generated by anodic electrochemical etching.

15 , to electrochemical reactions and selective etching.

16 s on each chip by gas-phase Xenon difluoride etching.

17 e realised with techniques like reactive ion etching.

18 ynamics by altering the crystal through acid etching.

19 and exposed on the surface through oxidative etching.

20 countercation on the rate of oleate induced etching.

21 ntal distance of a 10-90% height of a plasma-etched 150 nm thick electrode was measured to be 360 +/-

22 A microwave-etched 250 mum PEDOT:PSS electrode is employed for end-c

23 th smear layer, 2) after 37% phosphoric acid etching, 3) after the treatments, and 4) after 6% citric

24 the Au25 nanoclusters, exhibiting the potent etching activity.

25 Model self-etch adhesives were formulated with various components,

26 PVP can act as a capping and etching agent for protection of the outer surface nanopa

27 nd magnetic gold nanoclusters (MGNCs) as the etching agents is described.

28 of extra- and intracellular Ag by chemically etching AgNPs on the surface of algal cells and used dar

29 control of the graphene layers, atomic layer etching (ALE), a cyclic etching method achieved through

30 a member of the 'MXene' family), produced by etching aluminium from titanium aluminium carbide (Ti3Al

31 processing technology, such as lithography, etch and deposition techniques.

32 Selected adhesives were allowed to etch and extract HAp from enamel, light-cured in situ, a

33 time, that the use of EDC for both the self-etch and the etch-and-rinse approaches results in the re

34 ion of commercialized 10-MDP-containing self-etch and universal adhesives to human dentin.

35 The results show that the electrochemically etched and boiling-water immersed Al surfaces have excel

36 For XPB, dentin was etched and treated with 0.3 M EDC for 1 min and then bon

37 at CNTYMEs increased 3-fold after O2 plasma etching and 4-fold after antistatic gun treatment.

38 ich was prepared by Ag-assisted wet chemical etching and a photo-lithography process.

39 Overall, O2 plasma etching and antistatic gun treatment improve the sensiti

40 be yarn microelectrodes (CNTYMEs): O2 plasma etching and antistatic gun treatment.

41 Through sequential block etching and backfilling the resulting mesopores with dif

42 facile method combined with electrochemical etching and boiling water immersion is developed to fabr

43 his positive result, the simultaneous dentin etching and collagen protecting of GSE-containing phosph

44 The gold tips were fabricated by chemical etching and further encapsulated with carbon nanocones v

45 The conditions employed in the etching and growth processes also offer valuable insight

46 parison of scratches morphology after static etching and high-frequency ultrasonic agitation etching

47 es the entire Cu(2-x)Se core, accompanied by etching and partial collapse of the shell, yielding Cu(2

48 diffusion-limited behavior are found due to etching and partial dissolution of the initial ZIF-8 cry

49 The nanorings form during controlled etching and rearrangement of two-dimensional nanoplatele

50 electron-beam lithography (EBL), plasma dry etching and size reduction processes.

51 -effective silica micro-sphere approach, dry-etching and subsequent chemical etching.

52 Our approach incorporates gentle etching and/or fracturing of outer oxide-acetate layers

53 quantum dots through cation exchange (ionic etching), and facilitates renal clearance of metal ions

54 ty against salt-induced aggregation, oxidant etching, and repetitive freeze/thaw treatment-because of

55 restored with a commercial non-antibacterial etch-and-rinse adhesive (N) or an experimental antibacte

56 brid layer (HL) created by a self-etch or an etch-and-rinse adhesive after 1 y.

57 he use of EDC for both the self-etch and the etch-and-rinse approaches results in the reduction but n

58 themselves (irrespective of whether they are etch-and-rinse or self-etch) can activate these endogeno

59 probes were realized by a two-step selective etching approach that reduces the diameter of the nanotu

60 We present herein plasmon-assisted etching as an approach to extend the DIY theme to optics

61 ng SiNW prepared via metal-assisted chemical etching as anode material.

62 nes of the T. ventricosus were significantly etched at both pHSW-T 7.7 and 7.4 and their fracture for

63 en (SF6/O2) inductively coupled plasma (ICP) etching at cryogenic temperatures and we find it to be s

64 nocrystals with well-defined facets and then etching away the Pd templates.

65 , with neither sacrificial template nor core etching, because of geometrical frustration.

66 We also show that CuNPs are not etched by thiol solutions as previously reported, and ad

67 enerate Ox1 , which is capable of initiating etching by injecting holes into the semiconductor valenc

68 and Ti2GeC, suggesting that electrochemical etching can be a powerful method to selectively extract

69 Subsequently, plasma etching can be used to fabricate the arched stripe array

70 Simulated etching confirms that etching can be viewed as reversed growth.

71 e of whether they are etch-and-rinse or self-etch) can activate these endogenous protease proforms.

72 Compared to pristine CC, the plasma-etched carbon cloth (P-CC) has a higher specific surface

73 Zn oleate is shown to etch CdS nanorods anisotropically, where the length decr

74 s of a 1.2 cm x 1.2 cm mucolumn chip with an etched channel 0.5 m long and 46 mum x 150 mum in cross

75 -coupled 3.1 cm x 3.1 cm mucolumn chips with etched channels 3 m long and 250 mum x 140 mum in cross

76 ow unprecedented selectivity when exposed to etching conditions involving plasmas.

77 Simulated etching confirms that etching can be viewed as reversed

78 curable fluid resin infiltrant (without acid etching)-deep into the normal enamel layer.

79 re- and post-digestion morphology of an acid-etched dentin collagen layer that underwent PA treatment

80 emiconductor junction is used for activating etch, deposition, and modification steps localized to th

81 with the optimization of the grating coupler etching depth.

82 new analytical system based on Thermochromic Etching Discs (TED) technology is presented.

83 tructures can also result due to the initial etching effect of metal oleates.

84 On the other hand, the etching effect of plasma can simultaneously and effectiv

85 nces were not evident, but quick-freeze deep-etch electron microscopy provided insight into Bathycocc

86 Using deep-etch electron microscopy, we find that endogenous ESCRT-

87 ing the growth of enamel-like crystals on an etched enamel surface.

88 i inhibition was reversed by the presence of etched enamel surfaces and led to the formation of large

89 Acid-etched enamel surfaces of extracted human molars, cut pe

90 divided into 5 groups: HF (hydrofluoric acid-etching), Er:YAG laser + HF, Graphite + Er:YAG laser + H

91 Here we combine isothermal growth and etching experiments with in situ scanning electron micro

92 ift in Bragg wavelength (DeltalambdaB) of an etched FBG (eFBG) coated with an anti-CRP antibody (aCRP

93 1961, the development of an improved freeze-etching (FE) procedure to prepare rapidly frozen biologi

94 is used for topographical imaging of subtle etch features in a calcite crystal surface.

95 ht gold waveguides embedded in CYTOP with an etched fluidic channel.

96 ng stacked metal sheets followed by chemical etching, free-standing 2D metal (e.g., Ag, Au, Fe, Cu, a

97 s caused profound proteinuria, and with deep-etching freeze-fracture electron microscopy, we resolved

98 were cut from the fibres, and the silica was etched from one side, which exposed the core and formed

99 After 6 months, grit-blasted acid-etched (GBAE) PS implants with and without a MACH neck w

100 tion of the volumes of the micro wells in HF-etched glass and laser-ablated PDMS.

101 , and S. oralis biofilm removal from machine-etched glass and S. mutans from typodont surfaces with c

102 ptococcus oralis ATCC 9811, grown on machine-etched glass slides to generate a reproducible complex s

103 Mechanistically, the process of etching gold with excess thiol is unclear.

104 The etched h-BN was further purified and exfoliated into nan

105 rocesses containing laser patterning and wet etching have demonstrated the advantages of easily tunin

106 Without any applied electric field and post etching, hollow nanostructures can be directly fabricate

107 econdary caries resistance potential of acid-etched human coronal dentin bonded using augmented press

108 d by inductively coupled plasma-reactive ion etching (ICP-RIE) technique to produce amino-functionali

109 gold nanostructures as they are oxidatively etched in a graphene liquid cell with a controlled redox

110 rom silicon p-n junction specimens that were etched in ammonium fluoride solution.

111 The pores that form when Ti3 AlC2 is etched in dilute HF are around 0.5 nm in diameter.

112 nanostructures in solar cells without direct etching in a light absorbing semiconductor?

113 de (h-BN) basal plane surfaces via oxidative etching in air using silver nanoparticles as catalysts.

114 O2 plasma etching increased the sensitivity due to increased surfa

115 ate, whereas oleic acid alone does not cause etching, indicating the importance of the countercation

116 The sensing mechanism is based on CSH etching-induced fluorescence quenching of the bovine ser

117 are optically excited in rectangular pillars etched into a semi-insulating silicon carbide substrate.

118 Photonic crystals are etched into single mode low refractive index SiON film o

119 rrays of 62,500 ultrasmall reaction chambers etched into the surface of a fused silica slide to obser

120 diation through the array with small notches etched into their sides that act as scatterers.

121 acial polymerization, a facile oxygen-plasma etch is used to create size-selective pores (</=1 nm) in

122 The silver nanoparticle (AgNP) etching is based on the sensitivity of Ag to a hexacyano

123 ctional theory calculations suggest that the etching is initiated via a mechanism that involves the f

124 Electrochemical etching is used to slice off single-crystalline AlGaN/Ga

125 A methodological approach, based on bulk etch length, is proposed to uniquely characterize the pa

126 Plasma etching, lift-off, and ion implantation are realized wit

127 er was fabricated by metal-assisted chemical etching (MACE) procedure.

128 o a semiconductor by metal-assisted chemical etch (MacEtch), demonstrate enhanced transmission when c

129 cesses governing the metal-assisted chemical etching (MacEtch) of silicon (Si).

130 cted into the use of metal-assisted chemical etching (MacEtch) to fabricate vertical Si microwire arr

131 Highly selective etch masks are formed by thin films of a polystyrene-b-p

132 ALDI of standard peptides when using silicon-etched masks of various aperture sizes.

133 t processing steps including localized oxide etch, metal deposition, and process termination.

134 layers, atomic layer etching (ALE), a cyclic etching method achieved through chemical adsorption and

135 nosheets can be improved if we adopt an acid etching method on LCO to create more active edge sites,

136 btained by a facile one-step electrochemical etching method without any extra processing steps.

137 eaching and buffered hydrofluoric acid (BHF) etching methods.

138 mpact size, fabricated using an improved wet-etching micro-fabrication process with a higher qualifie

139 n the channel walls using micro reactive ion etching (micro-RIE).

140 Each adhesive was applied in the self-etch mode on midcoronal dentin according to the respecti

141 Helium plasma etched MoS2 layers for edge contacts.

142 tion of dopamine (PDOPA) on asymmetric track-etched nanopores.

143 t addition of Se precursors to the partially etched nanorods in Zn oleate solution can lead to epitax

144 suffer from high mass loss because of their etching nature.

145 environment were prepared by electrochemical etching of carbon fibers and subsequent coating with ele

146 ian blue-type thin films, formed by chemical etching of Co(OH)1.0(CO3)0.5.nH2O nanocrystals, yield a

147 bons using Fe nanoparticle-assisted hydrogen etching of epitaxial graphene/SiC(0001) in ultrahigh vac

148 ntraperitoneal tumor targeting and selective etching of excess untargeted quantum dots.

149 iator is a necessary component for efficient etching of gold by thiolates.

150 Etching of gold with an excess of thiol ligand is used i

151 ly considered the role of oxygen in thiolate etching of gold.

152 We review the selective etching of graphene to form edges and nanopores, which h

153 noporous silicon produced by electrochemical etching of highly B-doped p-type silicon wafers can be p

154 specific (edge and vertex) deposition of Pt, etching of inner Au, and regrowth of Au on the Pt framew

155 Unexpected etching of nanocrystals, nanorods, and their heterostruc

156 d after 500 cycles, which is ascribed to the etching of P into solution, as well as the oxidation of

157 tion of oxidant (X > 7.7) leads to oxidative etching of precursor colloids into significantly smaller

158 y confined to chemical and irradiation-based etching of preformed nanostructures.

159 con nanoparticles (NPs), obtained via anodic etching of Si wafers, as a basis for undecylenic acid (U

160 diode-pumped alkali laser and remote plasma etching of Si3N4 as examples, we demonstrate how accurat

161 eedles fabricated by metal-assisted chemical etching of silicon can access the cytosol to co-deliver

162 Photoelectrochemical etching of silicon can be used to form lateral refractiv

163 rising single atomic gold-catalyzed chemical etching of silicon.

164 n locally enhance the rate of vapor-phase HF etching of SiO2 to produce a SiO2 trench that is several

165 MXenes are produced by selective etching of the A element from the MAX phases, which are

166 Indium Tin Oxide (ITO) and rGO layer without etching of the rGO layer.

167 At MBE growth temperatures we observe etching of the sapphire wafer surface by the flux from t

168 WO3 precursor and protects against oxidative etching of the synthesized monolayers.

169 eans of a minimally destructive surface acid etching of tooth enamel and subsequent identification of

170 Lateral surface etching of two-dimensional (2D) nanosheets results in ho

171 sea urchins (euechinoids), but the impact of etching on skeleton mechanical properties is almost unkn

172 ron/ion beam processing, UV exposure, or wet etching on target substrates.

173 thin the hybrid layer (HL) created by a self-etch or an etch-and-rinse adhesive after 1 y.

174 y attributed to the electrocatalysis-induced etching or dissolution of Pt nanoparticles.

175 ted by adding materials without the need for etching or dissolution, processing is environmentally fr

176 size augmentations through either oxidative etching or seed-mediated growth of purified, monodispers

177 Modulation of the etching parameters allowed control of the nano-pore size

178 rates to different analytes depending on the etching parameters.

179 ndwiching two nanoporous polycarbonate track etched (PCTE) membranes with differently sized nanopores

180 biophysical effects on the mineral including etching, penetration and formation of new biominerals.

181 F plot compellingly connects the macroscopic etch pit hexagonal profile to the crystallographic hexag

182 ample was used to capture both a macroscopic etch pit image and an electron backscatter diffraction (

183 Direct comparison of the etch pit image and the ODF plot compellingly connects th

184 ich we interpret as the onset of homogeneous etch pit nucleation.

185 nsparency, and low cost, we expect microwave-etched polymer films to be a viable alternative to tradi

186 ty of chemical solutions combined with track-etched polymers to synthesize (i) vertical polycrystalli

187 Recently, we evolved tobacco etch potyvirus (TEV) lineages on different ecotypes of A

188 mutations fixed during adaptation of tobacco etch potyvirus (TEV) to a new experimental host, Arabido

189 For CSE, the self-etching primer was applied and treated with 0.3 M EDC fo

190 were prepared via an anodic electrochemical etching procedure, resulting in pSi particles with diame

191 The etch process is described, and the microwave-generated p

192 Using a repeated transfer-and-etch process, multilayer graphene was processed to contr

193 Attenuation of the etching process by radical scavengers in the presence of

194 mploys chronoamperometric pulsing in a 5 min etching process easily compatible with batch manufacturi

195 The dry-etching process is applicable to a wide variety of subst

196 Though, the sensitivity of the dry etching process is lower than the traditional "wet" elec

197 to elucidate if HAp released from the dental etching process is sufficient to trigger it.

198 Conventional wet-etching process was performed to form the nanocone-array

199 matic study varying parameters in the plasma etching process was performed to understand the relation

200 2 and SF6 flow rates in the cryogenic plasma etching process, different surface morphologies of the b

201 r than the traditional "wet" electrochemical etching process, it is suitable for many applications an

202 During the deep reactive ion etching process, the sidewalls of a silicon mold feature

203 a graphene monolayer using an oxygen plasma etching process, which allows the size of the pores to b

204 m-thick crystalline silicon chip by chemical etching process, which produced a flexible silicon chip.

205 Ap released from dental substrate during the etching process.

206 sm in which the oxygen radical initiates the etching process.

207 s of fs laser pulse trains followed by a wet etching process.

208 upled with an inductively coupled plasma dry etching process.

209 acids do not interfere with such CSH-induced etching process.

210 thin film vacuum deposition and reactive-ion etching processes eliminating complicated processes of d

211 Control over the deposition and etching processes is demonstrated by several parameters:

212 lithography technique and subsequent dry/wet etching processes.

213 Subsequent selective etching produces monoliths with morphologies that can be

214 latively hydrophilic surface after O2 plasma etching provided better resistance to fouling than unmod

215 Subsequent etching quenches excess quantum dots, leaving a highly t

216 peptides as model targeting ligands, can be etched rapidly and with minimal toxicity in mice, and th

217 temporally shaped fs pulses can enhance the etch rate by a factor of 37 times with better controllab

218 r thicker films, we show a saturation in the etch rate demonstrating a transport process that is domi

219 Sodium oleate enhances the etch rate, whereas oleic acid alone does not cause etchi

220 Conductive polymer etch rates are approximately 280-300 nm/minute.

221 m fluoropolymers to borosilicate glass, with etch rates in excess of 1 microm s(-1) .

222 The observed layer-dependent etching rates reveal the relative strength of the graphe

223 Regenerative electroless etching (ReEtching), described herein for the first time

224 Selective etch removal of material yields nanoporous films which d

225 to nanostructured magnetic ceramics, and as etch resists to plasmas and other radiation.

226 ge-scale integration (VLSI) and reactive ion etching (RIE), as two-dimensional periodic relief gratin

227 tured using inductively coupled plasma (ICP) etching, serving as photonic waveguides for radiation em

228 biofilm was disrupted from sandblasted, acid etched (SLA) Ti discs and polished Ti discs.

229 including: 1) sandblasted, large-grit, acid-etched (SLA); 2) calcium phosphate nano-coated (CaP); 3)

230 pproach to fabricate shaped nanoparticles by etching specific positions of atoms on facets of seed na

231 It is shown that with careful etching, sputtered Nb films can make high-quality and tr

232 cts, removing the need for any developing or etching steps but at the same time leading to true 3D de

233 substrates typically involve one or more wet-etching steps.

234 nvestigate a region close to the edges of an etched structure.

235 DPC imaging of an FeRh sample with HF-etched substrate reveals a state of AF/FM co-existence a

236 ame high-quality as the samples grown on BHF-etched substrates.

237 e substrates to flexible polycarbonate track etched supports with well-defined cylindrical approximat

238 apor deposition (CVD) to polycarbonate track-etched supports.

239 An implant with dual acid-etched surface (control) and an implant with dual acid-e

240 face (control) and an implant with dual acid-etched surface and CaP nanoparticles (test) were placed

241 Examination of the fractured faces and etched surfaces provided strong evidence that biological

242 of small needle-like HA crystals, formed on etched surfaces that were cut perpendicular to the ename

243 ecent research into thin-film deposition and etching techniques for mid-infrared materials shows pote

244 overcome this difficulty by adapting angled-etching techniques, previously developed for realization

245 r nanostructures defined by lithographic and etching techniques.

246 An inexpensive dry etch technology based on a low-pressure microwave plasma

247 the polycarbonate (PC) surface of the track-etched templating membrane.

248 It is found that CSH can etch the Au25 nanoclusters, exhibiting the potent etchin

249 The electrochemical reaction is then used to etch the thin oxide layer that forms on eutectic gallium

250 etween 500 and 650 degrees C PbO in the frit etches the SiNx antireflective-coating on the solar cell

251 -plane chemical ordering, and by selectively etching the Al and Sc atoms, we show evidence for 2D Mo1

252 nally hollow nanocages in the size ~10 nm by etching the centre of {200} facets.

253 ed magnetization reversal can be achieved by etching the continuous BiFeO3 film into isolated nanoisl

254 Thereafter etching the gold electrode significantly contributed to

255 Even at optimized experimental conditions, etching the gold electrodes could not be completely supp

256 The final products, after etching the PS, generated a highly ordered Au-nanohole a

257 single-crystalline membranes are produced by etching the Sr 3Al 2O 6 layer in water, providing the op

258 d lithography and inductively coupled plasma etching, the Si substrate was prepared with very high pa

259 bstrate using either Focused Ion Beam or wet etching through a block co-polymer mask.

260 ane was microfabricated by deep reactive ion etching through a porous aluminum oxide layer.

261 al pretreatment (Sr enrichment) and chemical etching (Ti enrichment).

262 surfaces was found to increase linearly with etching time where the pore size ranged from 4 to 12 nm

263 was evaluated on the premise of a 30-second etching time.

264 Grit-blasted acid-etched titanium disks were contaminated with multispecie

265 ing polymethyl methacrylate (PMMA) and a wet etch to allow the user to transfer the flakes to a final

266 ion, the nanoelectrode was electrochemically etched to create a recessed nanopore, followed by electr

267 4.5 mum diameter fibers that are chemically etched to create microwells in which modified microspher

268 Optionally, these parts are chemically etched to produce desired 3D shapes.

269 inner lumen of halloysite may be adjusted by etching to 20-30% of the tube volume and loading with fu

270 combining GSE treatment with phosphoric acid etching to address the issue.

271 res using 'short' or 'extended' reactive ion etching to produce 30-60 nm (diameter) nanodots or 100-2

272 imide substrate using UV lithography and wet etching to produce flexible transparent conducting elect

273 lf-assembled nanospheres, followed by custom-etching to produce nanometre size features on large-area

274 ntinuous precipitation followed by selective etching to remove one of the phases.

275 proach involves the use of oxygen plasma dry etching to thin down thick-exfoliated phosphorene flakes

276 ms consist of nanotubes grown across nanogap etch tracks and nanoribbons formed within the few-layer

277 Carbon nanotubes, few-layer graphene, and etch tracks exposing insulating SiO2 regions are integra

278 her by a matrix of slime; and (4) the comets etch trails in the agar as they move forwards.

279 A unique 3-dimensional etched-trench-channel configuration was used to allow fo

280 Vesicular stomatitis virus (VSV) and Tobacco etch virus (TEV), we found that increasing mutation does

281 4) in contrast to cap-dependent and tobacco etch virus internal ribosome entry site interaction with

282 ffinity than for either m(7)G cap or tobacco etch virus internal ribosome entry site, suggesting that

283 Engineering NCX1-Met(369) into a tobacco etch virus protease cleavage site revealed that specific

284 ific protein cleavage of YFP-TRF1 by tobacco etch virus protease resolves telomere aggregates, indica

285 tem based on a light-inducible split tobacco etch virus protease.

286 susceptible to inducible cleavage by tobacco etch virus protease.

287 the exogenous enzymatic activity of Tobacco Etch Virus Protease.

288 hing and high-frequency ultrasonic agitation etching was devoted in our case.

289 O2 plasma etching was performed by a microwave plasma system with

290 By chemical etching, we also can image the structural fingerprint fo

291 During etching, when ice is allowed to sublime after fracturing

292 ed on hydrofluoric acid (HF) electrochemical etching which is undesirable given the significant safet

293 nsport, and also solution ions and thin film etching, which can form the foundation of future studies

294 The TGNPs have been core etched with increasing concentration of cholesterol and

295 The microfluidic device is composed of glass etched with readily fabricated features that facilitate

296 non-scratched fused silica surfaces after HF etching with high-frequency ultrasonic agitation were al

297 re mitigated by mineral acid leaching and HF etching with multi-frequency ultrasonic agitation, respe

298 The method, based on etching with NH4F, is also applicable to other cage-cont

299 stencil mask and oxygen plasma reactive-ion etching, with a subsequent polymer-free direct transfer

300 machined (M) or a sandblasted (SLA) and acid-etched (ZLA) surface topography were produced.