1 g was performed 0, 1, 3, 5, and 10 min after light curing.

2 uency: 30 KHz) during and up to 10 min after light curing.

3 ed by FTIR and ranged between 55% for 9 s of light-curing and 67% for 40 s of light-curing followed b

4 l-ene chemistry is employed to achieve rapid light-curing and minimize residual monomer of the lead m

5                          Many of the current light-curing composite restorative techniques are ration

6  gaps continued to propagate after composite light curing finished.

7  for 9 s of light-curing and 67% for 40 s of light-curing followed by heat application.

8 ht-curing to a low of 36 microm with 40 s of light-curing followed by heat.

9 hermal and dynamic temperature scan DSC with light-curing occurring immediately, or at 5 or 10 minute

10 nto an adhesive system is detrimental to the light-curing thereof.

11 ranged from a high of 144 microm with 9 s of light-curing to a low of 36 microm with 40 s of light-cu

12                            The output from a light-curing unit (LCU) is commonly characterized by its