ライフサイエンスコーパス: polyimide

1 able method through pyrolysis of electrospun polyimide.

2 ectroplating or by etching Cu laminated with polyimide.

3 of 10 microm enhanced mu by a factor of 2 on polyimide, a factor of 2.5 on collagen-coated quartz, an

4 ntation and conformation changes at a rubbed polyimide alignment-layer surface.

5 We also used silicon wafer and flexible polyimide-aluminium foil substrates for solution-process

6 Prevention of polyimide aminolysis is achieved by using weakly alkalin

7 lar polymer blend comprising a chain-folding polyimide and a telechelic polyurethane with pyrenyl end

8 tached), whereas it was relatively weaker on polyimide and collagen-coated quartz (approximately 25%

9 zene-functionalized polymers (both amorphous polyimides and liquid crystal polymer networks) and repo

10 er subclasses (e.g., polyurea, polythiourea, polyimide), and the recognition of the untapped potentia

11 rfaces-rubbed polyimide, ion beam-irradiated polyimide, and ion beam-irradiated diamondlike carbon fi

12 ortion of the electrode: nail polish, epoxy, polyimide, and polypropylene coatings.

13 Two kinds of polyimides, aromatic and aliphatic type, are considered

14 by nanocomposite of magnetic graphene oxide-polyimide, as an efficient solid-phase extraction sorben

15 onsecutive 90 degrees twist angles along the polyimide backbone.

16 as established directly inside a cylindrical polyimide capillary.

17 rovides the first clear-cut demonstration of polyimide chain-folding and adjacent-tweezer binding.

18 thermocouple, this was circumvented with the polyimide chip by the addition of polyethylene glycol as

19 illary electrophoresis-UV instrument using a polyimide coated fused silica capillary and an in-house

20 rder to preserve the tensile strength of the polyimide coated fused-silica capillary.

21 erformed by using a 75-mum internal diameter polyimide-coated fused silica capillary (no inside coati

22 ion was created by removing 1-1.5 in. of the polyimide coating of the capillary and etching this sect

23 s and connecting lines are made of Pt with a polyimide coating to insulate the connecting lines.

24 We also demonstrated that the polyimide coating with microscale pores loses the confin

25 ca capillaries via aminolysis of their outer polyimide coating.

26 to address the issue of dendrite growth by a polyimide-coating layer with vertical nanoscale channels

27 This aromatic polyimide containing pendent cyanobiphenyl mesogens was

28 y amines can be used as electrolytes without polyimide degradation, whereas chemically resistant poly

29 using optimized buffer conditions to prevent polyimide degradation.

30 A high-yielding synthesis of a series of polyimide dendrimers, including decacyclene- and perylen

31 ntaining dendrimer D6, in which two types of polyimide dyes are present, is reported.

32 The electrospun polyimide employed is stable against highly reactive mol

33 electrodes that constitutes the mover and a polyimide film with the top and bottom surfaces coated w

34 he tribo-induced charges on the surface of a polyimide film, a fast relaxation within 3 min followed

35 he contact electrification on the surface of polyimide film.

36 The chip was fabricated by laminating polyimide films with laser-ablated channels, ports, and

37 on from laser-induced graphene on commercial polyimide films, followed by electrodeposition of pseudo

38 rowing carbon nanotubes (CNTs) directly on a polyimide flexible substrate at low temperatures (</=400

39 fabricated on alkali-free glass and flexible polyimide foil, exhibiting high performance.

40 s, to build a multilayer film structure on a polyimide foil.

41 er distance at detachment than the aliphatic polyimide for all of the three methodologies.

42 order at three carbonaceous surfaces-rubbed polyimide, ion beam-irradiated polyimide, and ion beam-i

43 oliter volumes in microchips fabricated from polyimide is demonstrated.

44 yimides, water sensitivity of the new hybrid polyimides is suppressed because of the silicone soft bl

45 ion of polycrystalline ZnO films on flexible polyimide (Kapton) substrates can be used to detect and

46 ion of the outermost molecules of the rubbed polyimide layer.

47 ectrode area was defined by a photosensitive polyimide mask.

48 ina was laser machined into the surface of a polyimide master chip.

49 Polyimide microtubing was placed near the RWM niche thro

50 d oxidize and/or remove part of, the surface polyimide of Kapton, the present Kapton surface modifica

51 ific adsorption to the surrounding material, polyimide, of the microcavity device was eliminated.

52 reaction can be used to prepare a series of polyimide (PI) COFs with pore size as large as 42 x 53 A

53 nanofibrous membrane with multiple cores of polyimide (PI) in the shell of polyvinylidene fluoride (

54 been constructed on nanoholes array textured polyimide (PI) substrates.

55 , we have described an apt method to prepare polyimide (PI)-modified aluminum nitride (AlN) fillers,

56 Among all polymer candidates, polyimides (PIs) are prominent due to their good thermal

57 We demonstrate that silicone block polyimide polymers have an unusually high sensitivity to

58 posited onto the TSM devices, silicone block polyimide polymers have partition coefficients of over 2

59 18-5.34-microm-thick films of silicone block polyimide polymers were deposited onto 10-MHz thickness

60 facial polymerization on top of cross-linked polyimide porous supports.

61 mperature (up to 900 degrees C) pyrolysis of polyimide precursor hollow-fiber membranes.

62 anostructures onto the working electrodes of polyimide printed circuit board platforms, resulting in

63 Ring-current magnetic shielding of polyimide protons by the pyrene "arms" of the tweezer mo

64 s of linear, conjugated organic molecules on polyimide scaffolds.

65 m fabrication on a wafer-level is based on a polyimide substrate and includes the patterning of plati

66 hickness were screen printed onto a flexible polyimide substrate followed by cold compaction and sint

67 sitive heterogeneous photosensor arrays on a polyimide substrate having organic sensor arrays and met

68 mesh/nanomesh structure were fabricated on a polyimide substrate using UV lithography and wet etching

69 e and 0.46 mW/(m K(2) ) at 664 K on flexible polyimide substrate, which is much higher than the value

70 led single-crystalline LiFe5 O8 thin film on polyimide substrate.

71 ively) deposited by sputtering on a flexible polyimide substrate.

72 100 mug/L was demonstrated on both glass and polyimide substrates.

73 (ZnO) sensing electrodes on flexible porous polyimide substrates.

74 le split ring resonators (DSRRs) on flexible polyimide substrates.

75 omatic, insoluble, engineering thermoplastic polyimides, such as pyromellitic dianhydride and 4,4'-ox

76 s achieved by fabricating the resonator on a polyimide support layer.

77 ess nearly planar chain conformations at the polyimide surface.

78 x 210 nm) on fused quartz and photosensitive polyimide surfaces.

79 ion of ITO NCs was also readily spin-cast on polyimide (T(g) ~360 degrees C), and the resultant ITO a

80 een achieved after mechanical rubbing of the polyimide thin film surface at room temperature and subs

81 The target consists of a polyimide tube filled with an ultra low-density plastic

82 mercially available 10-0 nylon sutures, fine polyimide tubes, and custom-made fine glass tubes were u

83 roporosity fabricated in situ on crosslinked polyimide ultrafiltration membranes show outstanding sep

84 n behavior and its governing mechanisms when polyimide undergoes various modes of detachment from sil

85 We observed that unlike conventional polyimides, water sensitivity of the new hybrid polyimid

86 ameworks dispersed within a high-performance polyimide, which can exhibit enhanced selectivity for et

87 The aromatic polyimide, which is more rigid due to the stronger charg

88 New rigid polyimides with bulky CF3 groups were synthesized and en

89 e as an alternative technique for processing polyimides with limited resolution and part fidelity.