ライフサイエンスコーパス: solder

1 the heatsink material and gold-tin eutectic solder.

2 with site-specific binding involving liquid solder.

3 s of capillary interactions involving liquid solder.

4 t report of dye-protein conjugates as tissue solders.

5 This simple and low cost technique for soldering and fabrication enables formation of complex s

6 ly active, and is a component in low-melting solders and solid-state lubricants.

7 ary interactions between the drops of molten solder; and (v) the assembly is finished by several proc

8 The completed micro-solder-bead bridges were found to have relatively low re

9 t, to trap, move, and chain individual micro-solder-beads in real-time via dielectrophoresis, we demo

10 d by AFM, which revealed some regions to be "soldered" by proteins, others to be heavily complexed wi

11 erve that fast intrinsic diffusion in SnAgCu solder causes void growth and coalescence, while in the

12 The substrates presented patterned, solder-coated areas that acted both as receptors for the

13 g complementary shapes, circuits, and liquid solder-coated areas were suspended in ethylene glycol an

14 cale polyhedra, with surfaces patterned with solder dots, wires, and light-emitting diodes, generated

15 dra-patterned with logic devices, wires, and solder dots-were connected in a linear string by using f

16 polymer rods-with embedded beads and exposed solder drops-are suspended in an approximately isodense

17 he GO/PEDOT gel can function as a metal-free solder for creating mechanical and electrical connection

18 These compounds can be used as "solders" for semiconductors widely used in photovoltaics

19 exposed areas of the beads are coated with a solder having a low melting point; (iv) the polymer rods

20 The addition of solder helped to bond crystal surfaces and link nano- or

21 s a substitute for the conventional tin-lead solder in all devices.

22 nd coalesce along the intermetallic compound/solder interface during EM testing.

23 ray of seven thin-wall stainless steel tubes soldered into a central hole of a cylindrical heating bl

24 electromigration in a Pb-free beta-Sn based solder joint by synchrotron polychromatic X-ray microdif

25 th great precision, the nucleation of tin in solder joints is currently left to chance.

26 n approach to incorporate the nucleants into solder joints to control the orientation of the tin nucl

27 PA inclusions (e.g., Field's metal, Pb-based solder), mechanical rigidity can be actively tuned with

28 le linkages between nanoparticle assemblies, soldering nanoelectronics, and constructing nanosensor d

29 rs, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating t

30 o wood dust (OR = 1.5; 95% CI: 0.8, 2.8) and solders (OR = 2.6; 95% CI: 0.9, 7.1).

31 ting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has be

32 sealed with a solder strip (POCW; n = 5), a solder patch (CPCW; n = 5), or three interrupted nylon 1

33 s was 82.76 mm Hg (SD, 6.55), whereas in the solder patch it was 101.42 mm Hg (SD, 29.92; P = 0.2222)

34 il-water interface before they assemble on a solder-patterned substrate that is pulled through the in

35 tween silicone oil, water, and a penetrating solder-patterned substrate.

36 fied) but could have been present in bricks, solder, pigs, or some other anthropogenic component rela

37 (SD, 9.38), and the mean IOP achieved in the solder repaired eyes was 125.16 mm Hg (SD, 9.85; P = 0.0

38 ound, a diode laser was used to activate the solder, resulting in cross-linking to tissue.

39 Wounds were sealed with a solder strip (POCW; n = 5), a solder patch (CPCW; n = 5)

40 growth and coalescence, while in the SN100C solder this coalescence was not significant.

41 The tested laser-activated solder was as effective as sutures when used as a patch

42 After the solder was placed on the wound, a diode laser was used t

43 or example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films wi

44 Minimization of the free energy of the solder-water interface provided the driving force for th

45 In this investigation, SnAgCu and SN100C solders were electromigration (EM) tested, and the 3D la

46 the particle type (Pb(II) > Brass > Pb(IV) > solder), while that of field particles was distributed b

47 eness of a laser-activated biological tissue solder with that of standard sutures for sealing corneal