戻る
「早戻しボタン」を押すと検索画面に戻ります。 [閉じる]

コーパス検索結果 (１語後でソート)

通し番号をクリックするとPubMedの該当ページを表示します
1 to arbitrary substrates like Si and flexible polyimide.
2 ene engraved onto the surface of microporous polyimide.
3 tom rings, and one 114-atom ring macrocyclic polyimide.
4 able method through pyrolysis of electrospun polyimide.
5 ectroplating or by etching Cu laminated with polyimide.
6 nthesis of large-area (cm(2) ), monolayer 2D polyimide (2DPI) with 3.1-nm lattice.
7 of 10 microm enhanced mu by a factor of 2 on polyimide, a factor of 2.5 on collagen-coated quartz, an
8 istic performance of edge-clamped monolithic polyimide aerogel blocks (12 mm thickness) has been stud
9 stantially robust ballistic performance, the polyimide aerogels have a potential to combat multiple c
10 ntation and conformation changes at a rubbed polyimide alignment-layer surface.
11      We also used silicon wafer and flexible polyimide-aluminium foil substrates for solution-process
12                                Prevention of polyimide aminolysis is achieved by using weakly alkalin
13 lar polymer blend comprising a chain-folding polyimide and a telechelic polyurethane with pyrenyl end
14 tached), whereas it was relatively weaker on polyimide and collagen-coated quartz (approximately 25%
15 zene-functionalized polymers (both amorphous polyimides and liquid crystal polymer networks) and repo
16                                      Various polyimides and polyamides have recently been prepared vi
17 er subclasses (e.g., polyurea, polythiourea, polyimide), and the recognition of the untapped potentia
18 rfaces-rubbed polyimide, ion beam-irradiated polyimide, and ion beam-irradiated diamondlike carbon fi
19 ortion of the electrode: nail polish, epoxy, polyimide, and polypropylene coatings.
20                                 Two kinds of polyimides, aromatic and aliphatic type, are considered
21  by nanocomposite of magnetic graphene oxide-polyimide, as an efficient solid-phase extraction sorben
22 onsecutive 90 degrees twist angles along the polyimide backbone.
23 cifically, a sandwich structure of elastomer/polyimide-based-electrode/elastomer, coated on one side
24 as established directly inside a cylindrical polyimide capillary.
25 me detect the electron migration step within polyimide cathode.
26 rovides the first clear-cut demonstration of polyimide chain-folding and adjacent-tweezer binding.
27 ental understanding of relationships between polyimide chemical structures and their gas transport pr
28 thermocouple, this was circumvented with the polyimide chip by the addition of polyethylene glycol as
29 illary electrophoresis-UV instrument using a polyimide coated fused silica capillary and an in-house
30 rder to preserve the tensile strength of the polyimide coated fused-silica capillary.
31 erformed by using a 75-mum internal diameter polyimide-coated fused silica capillary (no inside coati
32 ion was created by removing 1-1.5 in. of the polyimide coating of the capillary and etching this sect
33 s and connecting lines are made of Pt with a polyimide coating to insulate the connecting lines.
34                We also demonstrated that the polyimide coating with microscale pores loses the confin
35 ca capillaries via aminolysis of their outer polyimide coating.
36 to address the issue of dendrite growth by a polyimide-coating layer with vertical nanoscale channels
37                                This aromatic polyimide containing pendent cyanobiphenyl mesogens was
38 olled synthesis of few-layer two-dimensional polyimide crystals on the surface of water through react
39 y amines can be used as electrolytes without polyimide degradation, whereas chemically resistant poly
40 using optimized buffer conditions to prevent polyimide degradation.
41     A high-yielding synthesis of a series of polyimide dendrimers, including decacyclene- and perylen
42             This study reports 6FDA:BPDA-DAM polyimide-derived hollow fiber carbon molecular-sieve (C
43 na arrays were designed and constructed on a polyimide dielectric substrate with thickness of 125 um
44 ntaining dendrimer D6, in which two types of polyimide dyes are present, is reported.
45 hode, which far exceeds the state-of-the-art polyimide electrodes.
46                              The electrospun polyimide employed is stable against highly reactive mol
47 ys to further enhance the polynorbornene and polyimide families, enabling these capacitors to perform
48 ite of dielectrics in the polynorbornene and polyimide families.
49      Instead, the novel design is based on a polyimide film (Kapton) onto which finely powdered titan
50  electrodes that constitutes the mover and a polyimide film with the top and bottom surfaces coated w
51 he tribo-induced charges on the surface of a polyimide film, a fast relaxation within 3 min followed
52 he contact electrification on the surface of polyimide film.
53  nanofibers were deposited on the surface of polyimide films and exposed to varying RH, peptide/water
54       For example, unidirectional buffing of polyimide films on planar surfaces to give quadrupolar i
55        The chip was fabricated by laminating polyimide films with laser-ablated channels, ports, and
56 on from laser-induced graphene on commercial polyimide films, followed by electrodeposition of pseudo
57 rowing carbon nanotubes (CNTs) directly on a polyimide flexible substrate at low temperatures (</=400
58 fabricated on alkali-free glass and flexible polyimide foil, exhibiting high performance.
59 s, to build a multilayer film structure on a polyimide foil.
60 er distance at detachment than the aliphatic polyimide for all of the three methodologies.
61 tion, LSM can be made on various substrates (polyimide, glass, and hair), showing high generality.
62 s, the use of the liquid-crystalline polymer polyimide induces the formation of polymer-COF junctions
63 red by laser patterning of a metal-complexed polyimide into an interconnected graphene/nanoparticle n
64  order at three carbonaceous surfaces-rubbed polyimide, ion beam-irradiated polyimide, and ion beam-i
65 oliter volumes in microchips fabricated from polyimide is demonstrated.
66 yimides, water sensitivity of the new hybrid polyimides is suppressed because of the silicone soft bl
67 ion of polycrystalline ZnO films on flexible polyimide (Kapton) substrates can be used to detect and
68 ion of the outermost molecules of the rubbed polyimide layer.
69  a microstrip feedline created on the bottom polyimide-layer.
70 s consisting of liquid crystal elastomer and polyimide layers.
71 ectrode area was defined by a photosensitive polyimide mask.
72 ina was laser machined into the surface of a polyimide master chip.
73                                       Glassy polyimide membranes are attractive for industrial applic
74 ructure-property relationships of 6FDA-based polyimide membranes observed in this study offer guidanc
75  packing and plasticization tendency of such polyimide membranes via tuning the chemical structures w
76                           Herein, 6FDA-based polyimide membranes with engineered structures were synt
77                                              Polyimide microtubing was placed near the RWM niche thro
78 k-etch hydrophobic polycarbonate, track-etch polyimide, nanoporous anodic aluminum oxide, zeolite ZSM
79 d oxidize and/or remove part of, the surface polyimide of Kapton, the present Kapton surface modifica
80 ific adsorption to the surrounding material, polyimide, of the microcavity device was eliminated.
81 er electrodes rest on separate 1.5 mum thick polyimide patches with nearly identical thermal expansio
82 ogenic temperature of covalently crosslinked polyimide (PI) aerogels is achieved based on scalable an
83  reaction can be used to prepare a series of polyimide (PI) COFs with pore size as large as 42 x 53 A
84 emonstrated with an 8.6-mum-thick nanoporous polyimide (PI) film filled with polyethylene oxide/lithi
85            Laser lift-off (LLO) of ultrathin polyimide (PI) films is important in the manufacturing o
86 imple method for producing IWNs on ultrathin polyimide (PI) films.
87  nanofibrous membrane with multiple cores of polyimide (PI) in the shell of polyvinylidene fluoride (
88   Here we characterize CMS with the simplest polyimide (PI) PMDA/pPDA (PMDA=pyromellitic dianhydride,
89 been constructed on nanoholes array textured polyimide (PI) substrates.
90 nvolves crosslinking a phase inverted porous polyimide (PI) support membrane followed by interfacial
91              A series of rigid nonconjugated polyimide (PI)-based thermally activated delayed fluores
92 , we have described an apt method to prepare polyimide (PI)-modified aluminum nitride (AlN) fillers,
93                  Here, hierarchically porous polyimide (PI)/Ti(3)C(2)T(x) films with consecutively co
94                Among all polymer candidates, polyimides (PIs) are prominent due to their good thermal
95           We demonstrate that silicone block polyimide polymers have an unusually high sensitivity to
96 posited onto the TSM devices, silicone block polyimide polymers have partition coefficients of over 2
97 18-5.34-microm-thick films of silicone block polyimide polymers were deposited onto 10-MHz thickness
98 facial polymerization on top of cross-linked polyimide porous supports.
99 mperature (up to 900 degrees C) pyrolysis of polyimide precursor hollow-fiber membranes.
100 roach here should be broadly useful to other polyimide precursors and diverse gas pairs.
101  CMS "skin" derived from the 6FDA : BPDA/DAM polyimide precursors.
102 anostructures onto the working electrodes of polyimide printed circuit board platforms, resulting in
103           Ring-current magnetic shielding of polyimide protons by the pyrene "arms" of the tweezer mo
104 s of linear, conjugated organic molecules on polyimide scaffolds.
105     Mechanically assembled, 3D structures of polyimide serve as skeletons to offer anisotropic, nonli
106 ion sol-gel a-IGZO TFTs on a mesa-structured polyimide show an average saturation mobility of 6.06 cm
107 m fabrication on a wafer-level is based on a polyimide substrate and includes the patterning of plati
108                  The low thermal mass of the polyimide substrate and overlapping electrodes, as affor
109 odes fabricated on an ultrathin and flexible polyimide substrate as well as functionalized using poly
110 hickness were screen printed onto a flexible polyimide substrate followed by cold compaction and sint
111 sitive heterogeneous photosensor arrays on a polyimide substrate having organic sensor arrays and met
112 mesh/nanomesh structure were fabricated on a polyimide substrate using UV lithography and wet etching
113                                 The flexible polyimide substrate was used for easier handling during
114   The sensor is fabricated on a 90 mum-thick polyimide substrate with footprint of 18 x 15 x 0.5 mm(3
115  glucose sensor was fabricated on a flexible polyimide substrate with thickness less than 20 mum.
116                We demonstrate, on a flexible polyimide substrate, a sputtered Bi(2)Te(3)/GeTe TEG wit
117 oxide thin-film transistors(2) on a flexible polyimide substrate, enabling an ultralow-cost bendable
118               The graphene was produced on a polyimide substrate, showing a porous multi-layer struct
119 e and 0.46 mW/(m K(2) ) at 664 K on flexible polyimide substrate, which is much higher than the value
120 trodes (LAGEs) by direct laser scribing on a polyimide substrate, which were subsequently modified by
121 led single-crystalline LiFe5 O8 thin film on polyimide substrate.
122 ively) deposited by sputtering on a flexible polyimide substrate.
123 sed on metasurface implemented on two-layers polyimide substrates with a thickness of 500 mum.
124 d to realize devices on lightweight flexible polyimide substrates.
125 100 mug/L was demonstrated on both glass and polyimide substrates.
126  (ZnO) sensing electrodes on flexible porous polyimide substrates.
127 le split ring resonators (DSRRs) on flexible polyimide substrates.
128 omatic, insoluble, engineering thermoplastic polyimides, such as pyromellitic dianhydride and 4,4'-ox
129 s achieved by fabricating the resonator on a polyimide support layer.
130 ess nearly planar chain conformations at the polyimide surface.
131 x 210 nm) on fused quartz and photosensitive polyimide surfaces.
132 ion of ITO NCs was also readily spin-cast on polyimide (T(g) ~360 degrees C), and the resultant ITO a
133                              When printed on polyimide, the PT sensor exhibited no variation in the m
134 een achieved after mechanical rubbing of the polyimide thin film surface at room temperature and subs
135 l engineered support with a high-performance polyimide to create precursor fibers with a dense skin l
136                     The target consists of a polyimide tube filled with an ultra low-density plastic
137 mercially available 10-0 nylon sutures, fine polyimide tubes, and custom-made fine glass tubes were u
138 roporosity fabricated in situ on crosslinked polyimide ultrafiltration membranes show outstanding sep
139 n behavior and its governing mechanisms when polyimide undergoes various modes of detachment from sil
140         We observed that unlike conventional polyimides, water sensitivity of the new hybrid polyimid
141 ameworks dispersed within a high-performance polyimide, which can exhibit enhanced selectivity for et
142                                 The aromatic polyimide, which is more rigid due to the stronger charg
143 cluding cyclic and branched polysiloxanes or polyimides, which were generated by the steam-induced de
144 cluding cyclic and branched polysiloxanes or polyimides, which were generated by the steam-induced de
145 its effective conjugation length that endows polyimide with high triplet energy, and the "Linker" uni
146                                    New rigid polyimides with bulky CF3 groups were synthesized and en
147 e as an alternative technique for processing polyimides with limited resolution and part fidelity.

 
Page Top